intel usb 3.0 host controller for skylake cpu

Optimized Turbo Boost profiles allow higher frequencies even when many CPU cores are in use.CPU cores are arranged in an “Uncore” mesh interconnect (replacing the older dual-ring mesh interconnect).Optional 100Gbps Omni-Path fabric integrated into the processor (only available on certain SKUs).More I/O connectivity with 48 lanes of generation 3.0 PCI-Express per CPU (up from 40 lanes).Faster links between CPU sockets with up to three 10.4GT/s UPI links (replacing the older QPI interconnect).Optional 1.5TB-per-socket system memory support (only available on certain SKUs).Support for DDR4 memory speeds up to 2666MHz.Six-channel memory controller on each CPU (up from four-channel on previous platforms).Memory capacity & performance improvements:.Up to two AVX-512 FMA units per CPU core (depends upon CPU SKU).(up to 16 double-precision FLOPS per cycle per AVX-512 FMA unit) New AVX-512 instructions double performance.Floating Point and Integer Instruction performance improvements:.Important changes available in Xeon Scalable Processor Family “Skylake-SP” CPUs include: Note: these have since been superseded by the “Cascade Lake SP” Intel Xeon Processor Scalable Family CPUs. “Skylake-SP” processors replace the previous 14nm “Broadwell” microarchitecture (both the E5 and E7 Xeon families) and are available for sale as of July 11, 2017. This article provides in-depth discussion and analysis of the 14nm Intel Xeon Processor Scalable Family (formerly codenamed “Skylake-SP” or “Skylake Scalable Processor”).

Intel usb 3.0 host controller for skylake cpu